From September 9th to 11th, Core Fire Semiconductor will make its debut at the 2026 IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) held by Shenzhen International Convention and Exhibition Center (Baoan). The booth number is [to be added]. This exhibition is in the same period as CIOE China Optical Expo and elexcon Shenzhen Electronics Exhibition. One certificate will visit three exhibitions, penetrate the whole industry chain, and 320,000 square meters of super-large scale. It is expected to bring together more than 1,100 exhibitors and more than 60,000 professional visitors.

As a technology-oriented enterprise focusing on the research and development and manufacturing of high-purity silicon carbide (SiC) ceramic parts, Core Fire Semiconductor will highlight its technical capabilities and customized processing services in the field of semiconductor-grade high-purity SiC ceramic parts, CVD SiC parts and SiC coated parts at this exhibition. The company's products can be widely used in key semiconductor process equipment such as etching and thin film deposition, and are committed to providing high-purity, corrosion-resistant and thermal stability core component solutions for chip manufacturing.

During this exhibition, more than 20 high-standard professional forums will be held, covering the Integrated Circuit Innovation Summit Forum, the first Integrated Circuit Product and Application Collaborative Innovation Conference, the Advanced Packaging and Testing Technology Forum, the Semiconductor Manufacturing Core Equipment and Components Development Forum, etc., gathering experts and industry leaders at home and abroad to explore the industry trends and technology frontiers. Core Fire Semiconductor will take this opportunity to actively connect with industry resources, demonstrate technological innovation strength, and help the high-quality development of our country's integrated circuit industry. Sincerely invite friends from all walks of life to visit and exchange!