From August 31 to September 2, 2026, the 14th Semiconductor Equipment Materials and Core Components Exhibition (CSEAC 2026) will be held at Wuxi Taihu International Expo Center. Core Fire Semiconductor will be exhibiting at this exhibition, booth number B4-826.

CSEAC is an industry event in the field of semiconductor equipment materials and core components. This exhibition plans an exhibition area of more than 70,000 square meters and gathers more than 1,300 domestic and foreign exhibitors, covering the fields of wafer manufacturing equipment, packaging and testing equipment, core components and materials. During the same period of the exhibition, the "2026 China Electronics Special Equipment Industry Association Semiconductor Equipment Annual Conference" and more than 20 professional forums will be held to conduct in-depth discussions on semiconductor equipment, core components, key materials, advanced processes and other topics.

This exhibition has attracted companies from the United States, Japan, South Korea, Germany, Italy and other countries and regions to participate in the exhibition, and a number of domestic leading enterprises and international giants will appear on the same stage.

Core Fire Semiconductor focuses on the research and development and manufacturing of high-purity silicon carbide ceramic components, and will showcase the company's technical capabilities and customized processing services in the fields of semiconductor-grade high-purity SiC ceramic parts, CVD SiC parts, and SiC coated parts at this exhibition.

We warmly welcome industry colleagues to visit our booth (B4-826) to discuss the technological trends and customized solutions for semiconductor ceramic materials.