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Core Fire Semiconductor invites you to gather at IICIE 2026 to explore a new path for the localization of semiconductor ceramic components

Core Fire Semiconductor invites you to gather at IICIE 2026 to explore a new path for the localization of semiconductor ceramic components

2026-08-26 08:30:02
From September 9th to 11th, Core Fire Semiconductor will make its debut at the 2026 IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) held at Shenzhen International Convention and Exhibition Cen
300Mm wafer fab equipment spending continues to grow, driving demand for semiconductor ceramic parts

300Mm wafer fab equipment spending continues to grow, driving demand for semiconductor ceramic parts

2026-08-27 15:54:09
According to SEMI's latest 300mm fab equipment spending forecast report, global 300mm fab equipment spending is expected to reach $133 billion in 2026, an increase of 18% year-on-year; it will further increase to $151 bi
Precision Manufacturing Technology of SiC Ceramic Components with Complex Structure

Precision Manufacturing Technology of SiC Ceramic Components with Complex Structure

2026-08-27 15:54:09
The extremely high hardness and significant brittleness of silicon carbide ceramics make it difficult to fabricate complex structural parts through traditional processing methods, which has long restricted their wide app
Meet Wuxi | Core Fire at the 14th Semiconductor Equipment Materials and Core Components Exhibition

Meet Wuxi | Core Fire at the 14th Semiconductor Equipment Materials and Core Components Exhibition

2026-08-06 10:20:06
From August 31 to September 2, 2026, the 14th Semiconductor Equipment Materials and Core Components Exhibition (CSEAC 2026) will be held at Wuxi Taihu International Expo Center. Core Fire Semiconductor will be exhibiting
Horizontal furnace tube SiC components: structural design and process optimization

Horizontal furnace tube SiC components: structural design and process optimization

2026-08-27 15:54:09
In the heat treatment process of semiconductor manufacturing, the horizontal furnace tube is the core equipment of diffusion, oxidation, annealing and other processes. Silicon carbide components have become the key compo
The market for silicon carbide components for semiconductors continues to expand, and the process of domestic substitution is accelerating

The market for silicon carbide components for semiconductors continues to expand, and the process of domestic substitution is accelerating

2026-08-27 15:54:09
With the increasing complexity of semiconductor advanced process technology and the continuous growth of 300mm wafer fabrication investment, the market demand for semiconductor silicon carbide (SiC) parts is steadily exp
Preparation Process and Application Scenario of SiC Coating Parts

Preparation Process and Application Scenario of SiC Coating Parts

2026-08-27 15:54:09
In the process of semiconductor manufacturing, graphite materials are widely used in epitaxy, etching and other processes because of their excellent high temperature performance and processability. However, graphite mate
Preparation Process and Performance Advantages of CVD SiC Parts

Preparation Process and Performance Advantages of CVD SiC Parts

2026-08-27 15:54:09
Chemical vapor deposition (CVD) silicon carbide technology is a process technology for growing dense, high-purity silicon carbide crystal films on the surface of substrates through high-temperature chemical reactions. Th
SiC coating technology continues to make breakthroughs, and the lifespan and performance of key semiconductor consumables are both improved

SiC coating technology continues to make breakthroughs, and the lifespan and performance of key semiconductor consumables are both improved

2026-08-27 15:54:09
In the process of semiconductor manufacturing, graphite materials are widely used in epitaxy, etching and other processes because of their excellent high temperature performance and processability. However, graphite mate
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